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A digital signature architecture suitable for V2V applications
Mosanaei-Boorani, H.
- DOI:10.1109/TCSI.2023.3337121
- Main Entry: Mosanaei-Boorani, H.
- Title:A digital signature architecture suitable for V2V applications.
- Publisher:IEEE, 2024.
- Abstract:The elliptic curve digital signature algorithm (ECDSA) is widely used for guaranteeing data integrity and user authentication in internet of things (IoT) applications such as intelligent transport systems (ITS). In ITS, vehicles, infrastructures, and data networks communicate using vehicle-to-everything (V2X) protocols. In V2X message broadcasting, the ECDSA guarantees data security and privacy. During traffic congestion, the signature generation/verification latency becomes crucial. Hence, this paper proposes a high-throughput and efficient ECDSA architecture for vehicle-to-vehicle (V2V) applications. We investigate the double point multiplication (DPM) method for reducing computational overhead and propose a new finite field multiplier architecture for latency improvement. Our implementation results over p256 on Virtex-7 field programmable gate array (FPGA) show that our design’s throughput and efficiency are improved compared to previous works by at least 4.9× and 7.2×, respectively. This unit generates a signature in 167µs and verifies a message in 188µs. Also, our application-specific integrated circuit (ASIC) synthesis on 45nm and 180nm technologies can verify 4416 messages per second by consuming 1.3µJ and 9.4µJ energy, respectively. This advantage makes the design affordable for other IoT applications. © 2023 IEEE
- Notes:Sharif Repository
- Subject:Double point multiplication.
- Subject:Elliptic curve digital signature.
- Subject:Intelligent transport system (ITS)
- Subject:Vehicle-to-vehicle (V2V)
- Subject:Advanced traffic management systems.
- Subject:Computer architecture.
- Subject:Electronic document identification systems.
- Subject:Field programmable gate arrays (FPGA)
- Subject:Geometry.
- Added Entry:Bayat-Sarmadi, S.
- Added Entry:Sharif University of Technology.
- Source: IEEE Transactions on Circuits and Systems I: Regular Papers ; Volume 71, Issue 2 , 2024 , Pages 731-739 ; 15498328 (ISSN)
- Web Site:https://ieeexplore.ieee.org/document/10347366
